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MEMS Integration Engineer

Requirements:

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics or similar field, advanced degree preferred.
• 5+ years industrial experience in MEMS technology, preferably with experience in a variety of MEMS applications and devices.
• Thorough understanding of MEMS process integration and device design, as well as MEMS packaging and device testing.
• Direct experience in taking MEMS devices from design to fabrication and test in a commercial setting.
• Previous project and team management experience required.
• Experienced in the use of design of experiments and failure analysis methodologies.
• Ability to interface with various groups (R&D, Manufacturing, Management, etc.).
• Wide range of understanding and hands-on experience with various aspects of MEMS processing (e.g. DRIE, wafer bonding, microstructure release, double-side wafer alignment).
• Able to conceive and present new ideas effectively.
• High energy and motivation level to lead technology development.
• Customer focused.
• Strong communication and interpersonal skills.

Responsibilities:

• Interface directly with customers and provide technical expertise to customers and staff.
• Lead process integration for new MEMS based programs.
• Program management and significant technical contributions are expected (i.e. MEMS design, process integration, process flow development).
• Participation in developing concepts, design, prototyping, processes and testing of MEMS devices.

Please send your resume to careers@itcmems.com for consideration. Include a cover letter and salary requirements with the submission of your application.

About the Infotonics Technology Center
ITC combines experience and expertise with excellence in producing prototype and low volume MEMS solutions. What sets us apart is our vertically integrated approach to design, engineering, scalable fabrication, packaging and testing.

ITC offers the largest array of world-class MEMS-related services in the industry, all under one roof. Located outside Rochester, NY, the 140,000 square foot, state-of-the-art ITC facility includes over 50,000 square feet of certified clean room space running 150mm wafers, complemented by a dedicated 8,000 square foot MEMS and optoelectronic packaging facility.